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Shenzhen Geshem Technology Co., Ltd.
Shenzhen Geshem Technology Co., Ltd.
industrial computer design
all in one industrial pc
industrial computer design
all in one industrial pc

RK3399 Industrial Motherboard

EC3-RK3399

Six-core (dual-core A72+quad-core A53) 64-bit CPU;

Support Google Android 7.1 operating system GPU using the latest quad-core Mali-T860;

Able to play various formats of ultra-high-definition 4K2K video;

Using 8-layer high-density PCB board, integrated Gigabit Ethernet, 2.4G/5G dual-band WiFi/Bluetooth, RS485, built-in 4G module interface, and other functions;

Ultra-thin motherboard design.

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Benefits
Specification
Dimension

Benefits of EC3-RK3399

  • Six-core (dual-core A72+quad-core A53) 64-bit CPUSix-core (dual-core A72+quad-core A53) 64-bit CPU

  • EMMC8GB/16GB/32GB/64GB optional (default 16GB)

  • Android 7.1

  • 3*USB 2.0 + 1*USB3.0

  • 1* RJ45

  • 1*HDMI

  • 1*Line-out, 1*Mic-in

  • 1*DC-IN

Specification of EC3-RK3399

System Hardware
Dimension140*100*22mm
ProcessorSix-core (dual-core A72+quad-core A53) 64-bit CPU
ChipsetIntegrated on CPU
MemoryEMMC8GB/16GB/32GB/64GB optional (default 16GB)
Display
Audio1*Speaker output (D-class large built-in speaker, 3W*24R), 1*3.5 mm Jack (support headphone jack output, support microphone, reserved socket), 1* microphone input
LAN
Storage1*EMMC
Expansion1*MiniPCIe is used for peripheral expansion 4GLTE
OS
OSAndroid 7.1
I/O Ports
USB3*USB 2.0 + 1*USB3.0
LAN1* RJ45
Video1*HDMI
Audio1*Line-out, 1*Mic-in
1*DC-IN
Inside Pin
Serial port1*F_Pannel
1*F_Audio
4*RS232, 1*RS485, 1*TTL
6*USB-2.0HOST, 2*USB3.0HOST (support 1A output)
1*LVDS interface (single channel/dual channel, 6 bit 8 bit)
Spare IO 6 groups of IO detection ports: 1*12C, 1*ADC, 4*GPIO
1*SIM slot
Power
Power InputDC12V/2A (with DC-JACK and 1*4 pinWaferco-lay)
Power Consumption/
Environment
Operating Temp.-10℃~60℃
Storage Temp.-20℃~70℃, relative temperature 95%
Humidity


Dimension of EC3-RK3399

Dimension of EC3-RK3399

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