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Geshem EC3-RK3399 Overview

EC3-RK3399

Six-core (dual-core A72+quad-core A53) 64-bit CPU;

Support Google Android 7.1 operating system GPU using the latest quad-core Mali-T860;

Able to play various formats of ultra-high-definition 4K2K video;

Using 8-layer high-density PCB board, integrated Gigabit Ethernet, 2.4G/5G dual-band WiFi/Bluetooth, RS485, built-in 4G module interface, and other functions;

Ultra-thin motherboard design.

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Benefits

Specification

Dimension

Benefits of EC3-RK3399

Six-core (dual-core A72+quad-core A53) 64-bit CPUSix-core (dual-core A72+quad-core A53) 64-bit CPU
EMMC8GB/16GB/32GB/64GB optional (default 16GB)
Android 7.1
3*USB 2.0 + 1*USB3.0
1* RJ45
1*HDMI
1*Line-out, 1*Mic-in
1*DC-IN

Specification of EC3-RK3399

System Hardware
Dimension	14010022mm
Processor	Six-core (dual-core A72+quad-core A53) 64-bit CPU
Chipset	Integrated on CPU
Memory	EMMC8GB/16GB/32GB/64GB optional (default 16GB)
Display
Audio	1Speaker output (D-class large built-in speaker, 3W24R), 13.5 mm Jack (support headphone jack output, support microphone, reserved socket), 1 microphone input
LAN
Storage	1*EMMC
Expansion	1*MiniPCIe is used for peripheral expansion 4GLTE
OS
OS	Android 7.1
I/O Ports
USB	3USB 2.0 + 1USB3.0
LAN	1* RJ45
Video	1*HDMI
Audio	1Line-out, 1Mic-in
Audio	1*DC-IN
Inside Pin
Serial port	1*F_Pannel
	1*F_Audio
	4RS232, 1RS485, 1*TTL
	6USB-2.0HOST, 2USB3.0HOST (support 1A output)
	1*LVDS interface (single channel/dual channel, 6 bit 8 bit)
	Spare IO 6 groups of IO detection ports: 112C, 1ADC, 4*GPIO
	1*SIM slot
Power
Power Input	DC12V/2A (with DC-JACK and 1*4 pinWaferco-lay)
Power Consumption	/
Environment
Operating Temp.	-10℃～60℃
Storage Temp.	-20℃～70℃, relative temperature 95%
Humidity